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The bead-fused EPS cellular system disperses impact forces efficiently, supporting applications that require stable electronics packaging foam for fragile housings or internal components.
Surface-treated EPS delivers consistent anti static EPS foam performance (10⁸–10¹⁰ Ω), minimizing charge buildup during handling and international shipping of sensitive electronics.
Surface-treated EPS ensures consistent dissipative behavior (10⁸–10¹⁰ Ω), reducing static buildup during handling, assembly, and international shipping of sensitive electronics.
EPS molding enables accurate cavity shapes and channels, ideal for deep contours, multi-point support and integrated computer foam packaging designs.
Low-density EPS minimizes overall package weight while maintaining the mechanical protection expected from engineered electronics packaging foam.
Manufactured to meet global environmental and ESD standards, supporting anti static EPS foam inserts export programs requiring strict documentation and testing reports.
• Servers, communication machines & office equipment
• Medical diagnostic devices & laboratory instruments
• Home appliances & consumer electronics
• Precision housings, panels, and fragile surface components
• Export equipment packaging, etc.