NEWS

In dynamic industrial supply chains, the ability of packaging to withstand repeated physical abuse is a critical factor in managing logistics costs and ensuring product safety. While traditional materials offer single-use protection, high-performance applications—especially in the automotive, aerospace, and electronics sectors—demand a material with high resilience and structural memory. Expanded

In the manufacturing and logistics of electronic components—from integrated circuits to complex Printed Circuit Boards (PCBs)—the threat of electrostatic discharge (ESD) is constant and severe. An ESD event, often generated by simple friction or handling, can cause immediate component failure or, more insidiously, latent damage that reduces the product’s lifespan.

In the high-stakes world of aerospace, medical devices, and advanced electronics, precision instruments represent significant investment and are non-negotiable assets. The moment these components leave the production line, they face two primary threats: physical impact from drops and vibration, and invisible damage from electrostatic discharge (ESD). Selecting the correct packaging

For manufacturers of printed circuit boards (PCBs) and sensitive electronic assemblies, packaging must perform two functions: provide robust physical cushioning and mitigate the constant threat of electrostatic discharge (ESD). The choice often comes down to two highly effective polyethylene materials: Expanded Polystyrene (EPS) and Expanded Polyethylene (EPE). While both can

Transporting high-value equipment—be it sensitive medical devices, complex machinery, or sophisticated consumer electronics—across long distances introduces a high degree of risk. The logistical challenge involves protecting goods against severe, single-event impacts during handling, managing variable environmental conditions over weeks, and minimizing transit weight to control costs. Expanded Polystyrene, or EPS

The complexity of modern logistics—involving multi-modal transport, numerous transfer points, and varied climate exposure—presents a constant threat to product integrity. High-value or fragile goods are perpetually at risk from transit damage, leading to high warranty costs, customer dissatisfaction, and supply chain delays. To combat this, businesses must utilize packaging that